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Naslov: Creep-fatigue crack growth behavior of Pb-contained and Pb-free solders at room and elevated temperatures
Vir:

Procedia Engineering [1877-7058] Fakpan, K l. 2011, letn. 10, str. 1238 -1243

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  Dostopnost: Oddaljen dostop za študente in zaposlene Univerze na Primorskem.

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  Dostopnost: Dostop je mogoč iz prostorov Univerze na Primorskem.

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