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![](https://beacon01.alma.exlibrisgroup.com/boom/apache_pb.gif?SRVR=adz.izum.si&IP=193.2.126.232&A=SFX&P=SFXMenu&S=s677D9896-5EF6-11EF-A08C-656085CE164B&I=39IZM&T=&OP=Display&O=html&O1=15701031&O2=4100000007106681&O3=&O4=summon.serialssolutions.com&O5=https%3A%2F%2Fadz.izum.si%2Fsfxlcl41%3Fctx_enc%3Dinfo%253Aofi%252Fenc%253AUTF-8%26ctx_ver%3DZ39.88-2004%26rfr_id%3Dinfo%253Asid%252Fsummon.serialssolutions.com%26rft.atitle%3DA%2520Novel%25203D%2520AND-type%2520NVM%2520Architecture%2520Capable%2520of%2520High-density%252C%2520Low-power%2520In-Memory%2520Sum-of-Product%2520Computation%2520for%2520Artificial%2520Intelligence%2520Application%26rft.au%3DChang%252C%2520Hung-Sheng%26rft.au%3DChen%252C%2520Weichen%26rft.au%3DLue%252C%2520Hang-Ting%26rft.au%3DWang%252C%2520Keh-Chung%26rft.date%3D2018-06-01%26rft.eissn%3D2158-9682%26rft.epage%3D178%26rft.externalDocID%3D8510688%26rft.genre%3Dproceeding%26rft.pub%3DIEEE%26rft.spage%3D177%26rft.title%3D2018%2520IEEE%2520Symposium%2520on%2520VLSI%2520Technology%26rft_id%3Dinfo%253Adoi%252F10.1109%252FVLSIT.2018.8510688%26rft_val_fmt%3Dinfo%253Aofi%252Ffmt%253Akev%253Amtx%253Abook&O6=1-IEEE_ELECTRONIC_LIBRARY_IEL_UL_LCL-getFullTxt-object,2-IEEE_ELECTRONIC_LIBRARY_IEL_UM_LCL-getFullTxt-object,3-IEEE_IET_ELECTRONIC_LIBRARY_IEL-getFullTxt-object,4-IEEE_ELECTRONIC_LIBRARY_IEL_CONFERENCE_PROCEEDINGS_UL_LCL-getFullTxt-object,5-IEEE_ELECTRONIC_LIBRARY_IEL_CONFERENCE_PROCEEDINGS_UM_LCL-getFullTxt-object,6-DOI-getDOI-object,7-COBIB_SI_LCL-getHolding-object,8-AMAZON_FREE-getBookReview-object,9-REFWORKS_EXPORT_TOOL-getReference-object,10-GOOGLE_BOOK_SEARCH-getWebSearch-object,11-GOOGLE_SCHOLAR_FREE-getWebSearch-object,12-WWW_SEARCH_ENGINES_FREE-getWebSearch-object&O7=0.869034&O8=N&O9=<ctx:context-object identifier="urn:sfxstat:15701031-s677D9896-5EF6-11EF-A08C-656085CE164B" timestamp="2024-08-20T15:16:26Z" xmlns:ctx="info:ofi/fmt:xml:xsd:ctx">
<ctx:referent>
<ctx:identifier>urn:sfxid:4100000007106681</ctx:identifier>
<ctx:metadata-by-val>
<ctx:format>info:ofi/fmt:xml:xsd:journal</ctx:format>
<ctx:metadata>
<jnl:journal xmlns:jnl="info:ofi/fmt:xml:xsd:journal">
<jnl:atitle>A Novel 3D AND-type NVM Architecture Capable of High-density, Low-power In-Memory Sum-of-Product Computation for Artificial Intelligence Application</jnl:atitle>
<jnl:jtitle>2018 IEEE Symposium on VLSI Technology</jnl:jtitle>
<jnl:date>2018-06-00</jnl:date>
<jnl:spage>177</jnl:spage>
<jnl:epage>178</jnl:epage>
<jnl:genre>proceeding</jnl:genre>
<jnl:eissn>2158-9682</jnl:eissn>
<jnl:language>eng</jnl:language>
<jnl:authors></jnl:authors>
</jnl:journal>
</ctx:metadata>
</ctx:metadata-by-val>
</ctx:referent>
<ctx:requester>
<ctx:identifier>urn:ip:4bc9f213288fcf80662d288c0c22885ba725b128</ctx:identifier>
<ctx:identifier>urn:UUID:s677D9896-5EF6-11EF-A08C-656085CE164B</ctx:identifier>
</ctx:requester>
<ctx:referrer>
<ctx:identifier>info:sid/summon.serialssolutions.com</ctx:identifier>
</ctx:referrer>
<ctx:service-type>
<ctx:metadata-by-val>
<ctx:format>info:ofi/fmt:xml:xsd:svcList</ctx:format>
<ctx:metadata>
<svc:svcList xmlns:svc="http://www.exlibrisgroup.com/schema/info:ofi/fmt:xml:xsd:sch_svc"></svc:svcList>
</ctx:metadata>
</ctx:metadata-by-val>
</ctx:service-type>
<ctx:resolver>
<ctx:identifier>https://adz.izum.si/sfxlcl41</ctx:identifier>
</ctx:resolver>
</ctx:context-object>
&)