Contains information about title and source of a journal
Naslov:
A chip removal facility for indium bump bonded pixel detectors
Vir:
Nuclear Instruments & Methods in Physics Research Section A-Accelerators Spectrometers detectors and Associated Equipment
[0168-9002]
Airoldi,
A
l. 2005,
letn. 540,
št. 2-3,
str. 259
-265