Contains information about title and source of a journal
Naslov:
Adhesion of printed circuit boards with bending and the effect of reflow cycles
Vir:
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Schongrundner,
R
l. 2013,
str. 1
-8