Contains information about title and source of a journal
Naslov:
Characterization of indium and solder bump bonding for pixel detectors
Vir:
Nuclear Instruments & Methods in Physics Research Section A-Accelerators Spectrometers detectors and Associated Equipment
[0168-9002]
Cihangir,
S
l. 2002,
letn. 476,
št. 3,
str. 670
-675