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![](https://beacon01.alma.exlibrisgroup.com/boom/apache_pb.gif?SRVR=adz.izum.si&IP=193.2.126.232&A=SFX&P=SFXMenu&S=s3A8692D8-5F9C-11EF-BBEE-453885CE164B&I=39IZM&T=&OP=Display&O=html&O1=15782280&O2=110978984444703&O3=&O4=summon.serialssolutions.com&O5=https%3A%2F%2Fadz.izum.si%2Fsfxlcl41%3Fctx_enc%3Dinfo%253Aofi%252Fenc%253AUTF-8%26ctx_ver%3DZ39.88-2004%26rfr_id%3Dinfo%253Asid%252Fsummon.serialssolutions.com%26rft.atitle%3DCommon%2520Source%2520Line-to-Word%2520Line%2520Short%2520Improvement%2520by%2520Eliminating%2520SLT%2520Sidewall%2520Notch%2520in%25203D%2520NAND%2520Deep%2520Trench%2520Patterning%26rft.au%3DChang%252C%2520Chih-Chin%26rft.au%3DChu%252C%2520Yuan-Chieh%26rft.au%3DChung%252C%2520Yao-An%26rft.au%3DLee%252C%2520Hong-Ji%26rft.date%3D2023-05-01%26rft.eissn%3D2376-6697%26rft.epage%3D4%26rft.externalDocID%3D10121114%26rft.genre%3Dproceeding%26rft.pub%3DIEEE%26rft.spage%3D1%26rft.title%3D2023%252034th%2520Annual%2520SEMI%2520Advanced%2520Semiconductor%2520Manufacturing%2520Conference%2520%2528ASMC%2529%26rft_id%3Dinfo%253Adoi%252F10.1109%252FASMC57536.2023.10121114%26rft_val_fmt%3Dinfo%253Aofi%252Ffmt%253Akev%253Amtx%253Ajournal&O6=1-IEEE_ELECTRONIC_LIBRARY_IEL_UL_LCL-getFullTxt-object,2-IEEE_ELECTRONIC_LIBRARY_IEL_UM_LCL-getFullTxt-object,3-IEEE_IET_ELECTRONIC_LIBRARY_IEL-getFullTxt-object,4-DOI-getDOI-object,5-COBIB_SI_LCL-getHolding-object,6-REFWORKS_EXPORT_TOOL-getReference-object,7-GOOGLE_SCHOLAR_FREE-getWebSearch-object,8-WWW_SEARCH_ENGINES_FREE-getWebSearch-object&O7=1.154727&O8=N&O9=<ctx:context-object identifier="urn:sfxstat:15782280-s3A8692D8-5F9C-11EF-BBEE-453885CE164B" timestamp="2024-08-21T11:03:30Z" xmlns:ctx="info:ofi/fmt:xml:xsd:ctx">
<ctx:referent>
<ctx:identifier>urn:sfxid:110978984444703</ctx:identifier>
<ctx:metadata-by-val>
<ctx:format>info:ofi/fmt:xml:xsd:journal</ctx:format>
<ctx:metadata>
<jnl:journal xmlns:jnl="info:ofi/fmt:xml:xsd:journal">
<jnl:atitle>Common Source Line-to-Word Line Short Improvement by Eliminating SLT Sidewall Notch in 3D NAND Deep Trench Patterning</jnl:atitle>
<jnl:date>2023-05-01</jnl:date>
<jnl:spage>1</jnl:spage>
<jnl:epage>4</jnl:epage>
<jnl:issn>1078-8743</jnl:issn>
<jnl:genre>proceeding</jnl:genre>
<jnl:eissn>2376-6697</jnl:eissn>
<jnl:language>eng</jnl:language>
<jnl:authors></jnl:authors>
</jnl:journal>
</ctx:metadata>
</ctx:metadata-by-val>
</ctx:referent>
<ctx:requester>
<ctx:identifier>urn:ip:6a1a1deee7556a396b65ec706fcf5df20fa238b5</ctx:identifier>
<ctx:identifier>urn:UUID:s3A8692D8-5F9C-11EF-BBEE-453885CE164B</ctx:identifier>
</ctx:requester>
<ctx:referrer>
<ctx:identifier>info:sid/summon.serialssolutions.com</ctx:identifier>
</ctx:referrer>
<ctx:service-type>
<ctx:metadata-by-val>
<ctx:format>info:ofi/fmt:xml:xsd:svcList</ctx:format>
<ctx:metadata>
<svc:svcList xmlns:svc="http://www.exlibrisgroup.com/schema/info:ofi/fmt:xml:xsd:sch_svc"></svc:svcList>
</ctx:metadata>
</ctx:metadata-by-val>
</ctx:service-type>
<ctx:resolver>
<ctx:identifier>https://adz.izum.si/sfxlcl41</ctx:identifier>
</ctx:resolver>
</ctx:context-object>
&)