Contains information about title and source of a journal
Naslov:
Cyclic creep and fracture of a Cu–SiO2 bicrystal at an intermediate temperature of 673K
Vir:
Materials Science and Engineering A - Structural Materials Properties Microstructure and Processing
[0921-5093]
Miura,
H
l. 2009,
letn. 510-11,
str. 413
-416