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![](https://beacon01.alma.exlibrisgroup.com/boom/apache_pb.gif?SRVR=adz.izum.si&IP=193.2.126.232&A=SFX&P=SFXMenu&S=s605762D2-5F04-11EF-8A17-ACB284CE164B&I=39IZM&T=&OP=Display&O=html&O1=15707441&O2=3280000000025605&O3=&O4=summon.serialssolutions.com&O5=https%3A%2F%2Fadz.izum.si%2Fsfxlcl41%3Fctx_enc%3Dinfo%253Aofi%252Fenc%253AUTF-8%26ctx_ver%3DZ39.88-2004%26rfr_id%3Dinfo%253Asid%252Fsummon.serialssolutions.com%26rft.atitle%3DInvestigation%2520of%2520shape%2520etching%2520on%2520multi-layer%2520SiO2%252Fpoly-Si%2520for%25203D%2520NAND%2520architecture%26rft.au%3DFang-Hao%2520Hsu%26rft.au%3DHong-Ji%2520Lee%26rft.au%3DLo%2520Yueh%2520Lin%26rft.au%3DZusing%2520Yang%26rft.date%3D2013-05-01%26rft.eissn%3D2376-6697%26rft.epage%3D26%26rft.externalDocID%3D6552747%26rft.genre%3Dproceeding%26rft.isbn%3D9781467350068%26rft.issn%3D1078-8743%26rft.pub%3DIEEE%26rft.spage%3D24%26rft.title%3DASMC%25202013%2520SEMI%2520Advanced%2520Semiconductor%2520Manufacturing%2520Conference%26rft_id%3Dinfo%253Adoi%252F10.1109%252FASMC.2013.6552747%26rft_val_fmt%3Dinfo%253Aofi%252Ffmt%253Akev%253Amtx%253Abook&O6=1-IEEE_ELECTRONIC_LIBRARY_IEL_UL_LCL-getFullTxt-object,2-IEEE_ELECTRONIC_LIBRARY_IEL_UM_LCL-getFullTxt-object,3-IEEE_IET_ELECTRONIC_LIBRARY_IEL-getFullTxt-object,4-IEEE_ELECTRONIC_LIBRARY_IEL_CONFERENCE_PROCEEDINGS-getFullTxt-object,5-IEEE_ELECTRONIC_LIBRARY_IEL_CONFERENCE_PROCEEDINGS_UL_LCL-getFullTxt-object,6-IEEE_ELECTRONIC_LIBRARY_IEL_CONFERENCE_PROCEEDINGS_UM_LCL-getFullTxt-object,7-DOI-getDOI-object,8-COBIB_SI_LCL-getHolding-object,9-AMAZON_FREE-getBookReview-object,10-REFWORKS_EXPORT_TOOL-getReference-object,11-GOOGLE_BOOK_SEARCH-getWebSearch-object,12-GOOGLE_SCHOLAR_FREE-getWebSearch-object,13-WWW_SEARCH_ENGINES_FREE-getWebSearch-object&O7=1.12212&O8=N&O9=<ctx:context-object identifier="urn:sfxstat:15707441-s605762D2-5F04-11EF-8A17-ACB284CE164B" timestamp="2024-08-20T16:56:28Z" xmlns:ctx="info:ofi/fmt:xml:xsd:ctx">
<ctx:referent>
<ctx:identifier>urn:sfxid:3280000000025605</ctx:identifier>
<ctx:metadata-by-val>
<ctx:format>info:ofi/fmt:xml:xsd:journal</ctx:format>
<ctx:metadata>
<jnl:journal xmlns:jnl="info:ofi/fmt:xml:xsd:journal">
<jnl:atitle>Investigation of shape etching on multi-layer SiO<inf>2</inf>/poly-Si for 3D NAND architecture</jnl:atitle>
<jnl:jtitle>ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference</jnl:jtitle>
<jnl:date>2013-05-00</jnl:date>
<jnl:spage>24</jnl:spage>
<jnl:epage>26</jnl:epage>
<jnl:issn>1078-8743</jnl:issn>
<jnl:genre>proceeding</jnl:genre>
<jnl:eissn>2376-6697</jnl:eissn>
<jnl:language>eng</jnl:language>
<jnl:authors></jnl:authors>
</jnl:journal>
</ctx:metadata>
</ctx:metadata-by-val>
</ctx:referent>
<ctx:requester>
<ctx:identifier>urn:ip:4d9f735f0dfd1f031376f148713171183c420d7d</ctx:identifier>
<ctx:identifier>urn:UUID:s605762D2-5F04-11EF-8A17-ACB284CE164B</ctx:identifier>
</ctx:requester>
<ctx:referrer>
<ctx:identifier>info:sid/summon.serialssolutions.com</ctx:identifier>
</ctx:referrer>
<ctx:service-type>
<ctx:metadata-by-val>
<ctx:format>info:ofi/fmt:xml:xsd:svcList</ctx:format>
<ctx:metadata>
<svc:svcList xmlns:svc="http://www.exlibrisgroup.com/schema/info:ofi/fmt:xml:xsd:sch_svc"></svc:svcList>
</ctx:metadata>
</ctx:metadata-by-val>
</ctx:service-type>
<ctx:resolver>
<ctx:identifier>https://adz.izum.si/sfxlcl41</ctx:identifier>
</ctx:resolver>
</ctx:context-object>
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